IEEE International Conference on Metaverse Computing, Networking and Applications (MetaCom 2023)

June 26-28, 2023 · Kyoto, Japan.

http://www.ieee-metacom.org/2023

The First International Workshop on Visualization & Simulation in the Metaverse (VSM 2023)

Call for Papers

The First International Workshop on Visualization & Simulation in the Metaverse aims to bring together experts from the fields of computer graphics, visualization, simulation, and metaverse computing to explore the latest advancements and challenges in creating immersive, interactive, and data-driven simulations within the metaverse. The metaverse is a rapidly evolving domain that offers a unique opportunity to blend the virtual and physical worlds, creating new and exciting ways to interact, visualize, and simulate complex data and environments.

The workshop aims to foster discussions on how visualization and simulation can support the development of the metaverse and its applications, and how the metaverse can advance the state of the art in these fields. The goal is to bring together experts from various domains to exchange ideas and insights on the future of visualization and simulation in the metaverse and its real-world applications.

We welcome submissions from both academia and industry, and encourage authors to submit their work in a form that is accessible to a wide audience.

We invite original and high-quality papers that address the following topics, but not limited to:

• Digital Twin
• 3D design collaboration
• Data-driven simulations and modeling in the metaverse
• Applications of metaverse simulations in industries such as architecture, engineering, and construction (AEC), entertainment, healthcare, and gaming
• Metaverse data management and storage
• Design collaboration and cross-platform integration in the metaverse
• Multi-user interaction and collaboration in the metaverse
• Large-scale simulation in virtual space
• Integrating AI and machine learning into metaverse simulations
• User experience and interaction design for metaverse applications
• Networking and security issues in the metaverse
• Virtual reality and augmented reality in the metaverse
• The impact of 5G and edge computing on visualization and simulation in the metaverse

As the metaverse continues to evolve, platforms such as NVIDIA Omniverse play an important role in enabling collaboration, simulation, and training across multiple domains. The workshop will provide a unique opportunity to discuss the latest developments and challenges in this field, and to explore how visualization and simulation can contribute to the development of the metaverse.

We look forward to your contributions and to a productive and engaging workshop where we can shape the future of visualization and simulation in the metaverse together!

Submissions Guide

The workshop invites the submission of manuscripts presenting early and original research. These submissions should not be currently under review by another conference or journal, and should not have been previously published or posted on public websites. Submitted manuscripts should be formatted according to the IEEE Computer Society Proceedings Format, which includes double-spacing, 10pt font, letter size paper, and should be submitted in PDF format. The length of the paper should not exceed 6 pages in the standard IEEE conference format, including text, figures and references. All submitted papers will undergo a peer review process. Accepted and presented papers will be published in the IEEE MetaCom 2023 Conference Proceedings and made available in the IEEE Xplore database.

Manuscript templates are available on the workshop website. All submissions must be uploaded to EasyChair using the following link: https://easychair.org/conferences/?conf=metacom2023.

Organization Chairs

• Peiying (Colleen) Ruan, NVIDIA
• Hao (Vincent) Gong, NVIDIA
• Pallavi Mohan, NVIDIA
• Tomasz Bednarz, NVIDIA

Technical Program Committee

• TBD

Important Dates

• April 7, 2023, Paper submission deadline
• April 20, 2023 Notification of paper acceptance
• May 10, 2023, Camera-ready paper submissions