MetaCom 2023
IEEE International Conference on Metaverse Computing, Networking and Applications (IEEE MetaCom 2023)
June 26-28, 2023 · Kyoto, Japan
IEEE
IEEE CS

IEEE International Conference on Metaverse Computing, Networking and Applications (MetaCom 2023)

June 26-28, 2023 · Kyoto, Japan.

http://www.ieee-metacom.org/2023

The First Workshop on “Connecting Physical World to Metaverse using IoT and Digital Twin Platforms (Meta-XP)”

Call for Papers

The word “metaverse” is a portmanteau of the prefix “meta” (meaning beyond) and “universe”. Technically, a metaverse is a virtual space that allows people to have various virtual experiences, socialize, learn, collaborate and play. The metaverse now even connects to our physical world via Internet of Things and Digital Twin technologies.

Submitted papers in this workshop are expected to focus on state-of-the-art research in various aspects of Metaverse services using IoT and Digital Twin platforms from academics and industry viewpoints. The aim of this workshop is thus to offer a venue where researchers from both academia and industry can publish premier articles on the recent advances in theory, application, and implementation of the Metaverse concepts using IoT and Digital Twin platforms.

Papers describing technologies and ideas that can be used in IoT and Digital Twin platforms for Metaverse are also welcome. The workshop and its topics are timely and highly relevant to create a Metaverse ecosystem.

Submitted papers in this workshop are expected to focus on state-of-the-art research in various aspects of Metaverse services using IoT and Digital Twin platforms from academics and industry viewpoints. The aim of this workshop is thus to offer a venue where researchers from both academia and industry can publish premier articles on the recent advances in theory, application, and implementation of the Metaverse concepts using IoT and Digital Twin platforms.

Topics

Topics of interests include, but are not limited to, the following areas:

  • IoT platforms for Metaverse
  • Digital Twin platforms for Metaverse
  • Sensor technologies and platforms for Metaverse
  • Global standardization activities for Metaverse (e.g., oneM2M, 3GPP, ITU-T, IETF)
  • Common data model for Metaverse
  • Deployment options of various platforms (IoT, Smart City, Digital Twin) for Metaverse
  • Data management for Metaverse services
  • Experiences and field trials of Metaverse with IoT and Digital Twin
  • Security, trust, privacy and identity in the Metaverse
  • Heterogeneous platforms interworking for Metaverse
  • Data optimization in Metaverse
  • Interoperability between Metaverse platforms
  • AI for Digital Twin and Metaverse
  • Synchronization of physical world and virtual world

Submissions Guide

Submitted papers must represent original material that is not currently under review in any other conference or journal and has not been previously published. Paper length should not exceed the six-page standard IEEE conference two-column format (including all text, figures, and references). Please see the Author Information page for submission guidelines in the IEEE MetaCom 2023. All submitted papers will go through a peer review process. All accepted and presented papers will be included in the IEEE MetaCom 2023 proceedings. IEEE reserves the right to exclude an accepted and registered but not presented paper from the IEEE digital library. Please follow the submission link on https://easychair.org/conferences/?conf=metacom2023 to submit your paper.

Organizing Chairs

Publicity Chair

Program Committee Members

  • Jaeho Kim, Sejong University, South Korea
  • JaeSeung Song, Sejong University, South Korea
  • Jeongwook Seo, Hanshin University, South Korea
  • TSunghyup Lee, Korea Communications Agency (KCA), South Korea
  • Cheolsoo Park, Kwangwoon University, South Korea
  • Seong Yoo, Coventry University, UK
  • Tarik Taleb, Oulu University, Finland
  • Shane He, Nokia, China
  • Andreas Kunz, Lenovo, Germany
  • Roland Hechwartner, Deutsche Telekom, Austria
  • Andrew Min-Gyu Han, Hansung University, South Korea
  • Andreas Kraft, Deutsche Telekom, Germany
  • Kanghae Lee, Telecommunication Technology Association (TTA), South Korea
  • Sookhyun Jeon, Telecommunication Technology Association (TTA), South Korea
  • NakMyoung Sung, Korea Electronics Technology Institute (KETI), South Korea
  • Seungmyeong Jeong, Korea Electronics Technology Institute (KETI), South Korea
  • Yonggeun Hong, Daejeon University, South Korea
  • Dohyun Kim, Jeju University, South Korea
  • Jaeseok Yoon, Soonchunhyang University, South Korea

Important Dates

  • March 20, 2023, Manuscript submission
  • April 20, 2023 Notification of acceptance
  • May 10, 2023, Camera-ready final manuscript due

Submission Link

https://easychair.org/conferences/?conf=metacom2023


Workshops

Important Days

  • Mar 20, 2023

    Paper Submission Due

  • Apr 20, 2023

    Author Notification

  • May 10, 2023

    Camera-Ready Due

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